Zhen Ding Technology Holding Limited (Ticker: 4958), a global leading PCB manufacturer, will participate in SEMICON Taiwan 2026 from September 2 to September 4 at the Taipei Nangang Exhibition Center. At its booth in the AI Technology Zone on the 4th floor of Hall 2 (Booth S6000), Zhen Ding will showcase a range of advanced products, including 800G, 1.6T, XPO and NPO optical modules, as well as high-end AI server boards with up to 34 layers. From high-speed data transmission to ultra-high-layer-count PCBs, the exhibits will highlight Zhen Ding’s advanced PCB technologies and capabilities in support of next-generation AI infrastructure.
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Zhen Ding Tech. Group
Zhen Ding Showcases Next-Generation High-End PCB Technologies at SEMICON Taiwan 2026: 1.6T Optical Modules and 34-Layer AI Server Boards to Support Next-Generation AI Infrastructure
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