On May 27,2025, General Manager Chen-Fu Chien of Zhen Ding Technology Group was invited to attend the "2025 Two Thousand Forum" held by The CommonWealth Magazine. He delivered a speech on "PCB Industry Development and Global Layout", sharing forward-looking insights on vertical integration of PCB industry and semiconductor industry, as well as the development blueprint of Zhen Ding Technology Group.

Semiconductor driven PCB industry innovation co-prosperity
With the continuous evolution of Moore's Law, the PCB industry and the semiconductor industry are closely symbiotic. On the one hand, semiconductor technology continues to challenge physical limits. On the other hand, the development of More Moore and More than Moore has put forward higher requirements for PCB performance and smart manufacturing technology. Zhen Ding Technology Group is actively driving its transformation from excellence to outstanding performance, such as IC substrate technology and high-density circuit design, to support the continuous miniaturization of chips and ensure efficient data transmission and processing. Over the past 20 years, the body size of the substrate has increased by about 20 times, the number of layer count has more than quadrupled, and the number of bump count has increased by over 300 times, resulting in a comprehensive benefit improvement of over 24,000 times. This growth aligns with the pace of improvement seen in Moores Law, supporting the development of the semiconductor industry. Charles Shen , chairman of Zhen Ding Technology Group, has mastered the trend and proposed the One ZDT strategy, actively deployed the cloud network and provided a comprehensive solution. This year, AI products accounted for more than 70%.
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