Language
中文English
Product SearchSearch
Try searching again

Search results for

alt
No Results Found

Please try a different search term

Zhen Ding Tech. Group

Products & Services
ICS
ICSalt

ICS

IC substrate is an intermedium that communicates chip and circuit board. Chip and circuit board can be connected by its internal circuit. It is a key component of the IC packaging process which characterized by light weight, small size, stable quality and excellent information access.

Feature
Product Feature
  • Small, light, thin, with high wiring density. Providing the best carrier for miniature design of electronic devices.
  • Providing chip protection and effective heat dissipation with its semiconductor packaging process.
  • According to different packaging methods, it can be divided into CSP, fcCSP, SiP, etc.
Application