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Zhen Ding Tech. Group
IC substrate is an intermedium that communicates chip and circuit board. Chip and circuit board can be connected by its internal circuit. It is a key component of the IC packaging process which characterized by light weight, small size, stable quality and excellent information access.
- Small, light, thin, with high wiring density. Providing the best carrier for miniature design of electronic devices.
- Providing chip protection and effective heat dissipation with its semiconductor packaging process.
- According to different packaging methods, it can be divided into CSP, fcCSP, SiP, etc.