Zhen Ding Tech. Group
SLP: Substrate-Like PCB. SLP is called the "next generation of PCB". The L/S of SLP can be as low as 20/35um, compared to 40/50um of HDI. SLP is closer to IC substrate used for semiconductor packaging in manufacturing process.
- The mSAP process can produce extremely detailed circuits, between HDI and IC carrier board.
- Thinner and smaller size, suites the compact design for new-generation consumer electronics.
- Good reliability, meeting the requirements of high-end customers.