Zhen Ding Tech. Group

IC Heterogeneous Integration and Advanced Packaging Zhen Ding Drives AI-Powered Digital Transformation

Driven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
At SEMICON Taiwan 2025’s High-Tech Smart Manufacturing Forum, President of Zhen Ding Technology Holding Limited (Stock Code: 4958), Chen-Fu Chien, delivered the opening keynote. He reviewed how wafer manufacturing has long advanced under Moore’s Law, with continuous process scaling enabling flourishing development across various application fields. However, as scaling approaches physical limits and economic considerations of cost-effectiveness intensify, heterogeneous integration and advanced packaging technologies have emerged as new growth drivers to realize the vision of “More than Moore.”

Zhen Ding Announces the Appointment of Dr. Chen-Fu Chien as General Manager to Accelerate Digital Transformation and Strengthen Business Developments with the Semiconductor Supply Chain

Zhen Ding Announced Its Operating Results for the First Half of 2025

Zhen Ding Announced Its Operating Results for the First Half of 2025

Avary Holding, a Subsidiary of Zhen Ding, Board Approves Huai’an Park Investment Plan

Avary Holding, a Subsidiary of Zhen Ding, Board Approves Huai’an Park Investment Plan

Zhen Ding Returns to SEMICON Taiwan 2025, Unveiling a New Landscape of PCB Expanding into Semiconductors Advantech Empowers the Creation of AI Smart Parks, Jointly Building a New Model for Smart and Green Manufacturing

Zhen Ding Technology Holding Co., Ltd. (Stock Code: 4958), a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025 today (the 10th). Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout. Zhen Ding stated that this exhibition is not only a concrete demonstration of its R&D achievements but also a declaration of its industry status, symbolizing the company’s evolution from a PCB leader to a key driver in the semiconductor industry chain, injecting continuous momentum into the development of AI applications.
With the increasing complexity of chips and the popularization of 3D packaging, PCB is no longer merely a circuit carrier, but a critical link determining whether computing power can be fully unleashed. In particular, many AI applications impose stringent requirements on PCBs, such as high frequency, high speed, high density, high reliability, and low energy consumption. A single manufacturing process can hardly meet these demands; thus, integrating different processes—including high-end IC substrates, high-end HDI/MSAP substrates, and HLC thick large boards—has become the key to achieving performance breakthroughs. Centering on the "One ZDT" strategy, Zhen Ding will fully deploy "cloud, pipe, and device" applications in the AI era, provide customers with the most comprehensive solutions, and leverage its advantage in the vertical integration layout of the full AI PCB product line to continuously widen the leading gap with competitors in the AI era.
Beyond forward-looking technological layout, Zhen Ding is also actively advancing AI smart manufacturing and green digital transformation. Through cooperation with Advantech (Stock Code: 2395), a leader in the industrial IoT industry, Zhen Ding has achieved multi-faceted results in digital transformation. It has now adopted Advantech’s energy management platform, and Advantech has also shared solutions and implementation experience related to smart parks and carbon management platforms. These achievements not only enhance energy conservation and carbon reduction efforts but also reflect Zhen Ding’s commitment to sustainable ESG practices.

Zhen Ding Returns to SEMICON Taiwan 2025, Unveiling a New Landscape of PCB Expanding into Semiconductors Advantech Empowers the Creation of AI Smart Parks, Jointly Building a New Model for Smart and Green Manufacturing

Zhen Ding Technology Holding Co., Ltd. (Stock Code: 4958), a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025 today (the 10th). Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout. Zhen Ding stated that this exhibition is not only a concrete demonstration of its R&D achievements but also a declaration of its industry status, symbolizing the company’s evolution from a PCB leader to a key driver in the semiconductor industry chain, injecting continuous momentum into the development of AI applications.
With the increasing complexity of chips and the popularization of 3D packaging, PCB is no longer merely a circuit carrier, but a critical link determining whether computing power can be fully unleashed. In particular, many AI applications impose stringent requirements on PCBs, such as high frequency, high speed, high density, high reliability, and low energy consumption. A single manufacturing process can hardly meet these demands; thus, integrating different processes—including high-end IC substrates, high-end HDI/MSAP substrates, and HLC thick large boards—has become the key to achieving performance breakthroughs. Centering on the "One ZDT" strategy, Zhen Ding will fully deploy "cloud, pipe, and device" applications in the AI era, provide customers with the most comprehensive solutions, and leverage its advantage in the vertical integration layout of the full AI PCB product line to continuously widen the leading gap with competitors in the AI era.
Beyond forward-looking technological layout, Zhen Ding is also actively advancing AI smart manufacturing and green digital transformation. Through cooperation with Advantech (Stock Code: 2395), a leader in the industrial IoT industry, Zhen Ding has achieved multi-faceted results in digital transformation. It has now adopted Advantech’s energy management platform, and Advantech has also shared solutions and implementation experience related to smart parks and carbon management platforms. These achievements not only enhance energy conservation and carbon reduction efforts but also reflect Zhen Ding’s commitment to sustainable ESG practices.

The Era of Computing Power: AI Reshapes the PCB Industry Landscape

Artificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation. At the SEMICON Taiwan 2025 Innovation Technology Conference on Sep 11th, Allen Chien, Senior Manager of Zhen Ding Technology Holding Co., Ltd. (Stock Code: 4958), highlighted that global computing power is expected to surge nearly a hundredfold by 2030 compared to 2021. This growth is driving cloud service providers to invest heavily in AI servers and data centers. This infrastructure race is not only accelerating the advancement of the semiconductor industry but also underscoring the indispensable role of PCBs in the era of computing power.
As Moore’s Law approaches its limits, breakthroughs in computational performance increasingly rely on advanced packaging and heterogeneous integration. Most mainstream high-performance computing chips now adopt multi-chip module designs, integrating logic computing units, high-bandwidth memory, and other components closely on the same substrate. This approach shortens signal transmission distances, reduces power consumption, and enhances computing efficiency. Such technological evolution has transformed PCBs from merely serving as signal transmission and structural support components into the core backbone determining system performance.

The Era of Computing Power: AI Reshapes the PCB Industry Landscape

Artificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation. At the SEMICON Taiwan 2025 Innovation Technology Conference on Sep 11th, Allen Chien, Senior Manager of Zhen Ding Technology Holding Co., Ltd. (Stock Code: 4958), highlighted that global computing power is expected to surge nearly a hundredfold by 2030 compared to 2021. This growth is driving cloud service providers to invest heavily in AI servers and data centers. This infrastructure race is not only accelerating the advancement of the semiconductor industry but also underscoring the indispensable role of PCBs in the era of computing power.
As Moore’s Law approaches its limits, breakthroughs in computational performance increasingly rely on advanced packaging and heterogeneous integration. Most mainstream high-performance computing chips now adopt multi-chip module designs, integrating logic computing units, high-bandwidth memory, and other components closely on the same substrate. This approach shortens signal transmission distances, reduces power consumption, and enhances computing efficiency. Such technological evolution has transformed PCBs from merely serving as signal transmission and structural support components into the core backbone determining system performance.

Zhen Ding Held the Groundbreaking Ceremony for “Zhen Ding Time Center”, Creating a Joint Hub for PCB and Cultural Industries

IC Heterogeneous Integration and Advanced Packaging Zhen Ding Drives AI-Powered Digital Transformation

Driven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
At SEMICON Taiwan 2025’s High-Tech Smart Manufacturing Forum, President of Zhen Ding Technology Holding Limited (Stock Code: 4958), Chen-Fu Chien, delivered the opening keynote. He reviewed how wafer manufacturing has long advanced under Moore’s Law, with continuous process scaling enabling flourishing development across various application fields. However, as scaling approaches physical limits and economic considerations of cost-effectiveness intensify, heterogeneous integration and advanced packaging technologies have emerged as new growth drivers to realize the vision of “More than Moore.”

#SEMICONTaiwan 2025 is coming to an end!

Zhen Ding Technology Group exchanged insights on industry trends with supply chain partners and engaged with numerous potential customers, delivering on global needs through One ZDT. As the PCB and semiconductor ecosystems converge through heterogeneous integration, the industry landscape is being quietly reshaped, while AI computing power and innovative applications are unlocking new opportunities for growth. We sincerely thank all our distinguished guests and partners for joining us. Zhen Ding will continue to push beyond limits, strengthen its pivotal position, and drive a new chapter of co-creation between PCB and semiconductors. We look forward to seeing you next year!

Zhen Ding Builds a New Blueprint of “Semiconductor + Advanced Packaging + PCB” “One ZDT” Strategy Rides the Wave of Heterogeneous Integration to Seize the AI Industry High Ground

The annual PCB industry event, TPCA Show 2025, kicked off today (Oct. 22) at the Nangang Exhibition Center. Zhen Ding Tech. Group (Stock Code: 4958 showcased a full range of high-end PCBs and IC substrates under the theme of Artificial Intelligence (AI). Chairman Charles Shen pointed out that over the past 20 years, IC substrates have grown 20 times larger, increased in layer count by more than fourfold, and seen connection points surge by 300 times — resulting in overall complexity rising over 24,000 times. This evolution signifies that PCBs have transformed from mere connectors into core enablers of AI computing performance. Facing this AI- and high-performance computing-driven revolution, Zhen Ding has strengthened its “One ZDT” strategic layout, pioneering a new ecosystem of “Semiconductor + Advanced Packaging + PCB” to fuel future growth momentum.

Zhen Ding Builds a New Blueprint of “Semiconductor + Advanced Packaging + PCB” “One ZDT” Strategy Rides the Wave of Heterogeneous Integration to Seize the AI Industry High Ground

The annual PCB industry event, TPCA Show 2025, kicked off today (Oct. 22) at the Nangang Exhibition Center. Zhen Ding Tech. Group (Stock Code: 4958 showcased a full range of high-end PCBs and IC substrates under the theme of Artificial Intelligence (AI). Chairman Charles Shen pointed out that over the past 20 years, IC substrates have grown 20 times larger, increased in layer count by more than fourfold, and seen connection points surge by 300 times — resulting in overall complexity rising over 24,000 times. This evolution signifies that PCBs have transformed from mere connectors into core enablers of AI computing performance. Facing this AI- and high-performance computing-driven revolution, Zhen Ding has strengthened its “One ZDT” strategic layout, pioneering a new ecosystem of “Semiconductor + Advanced Packaging + PCB” to fuel future growth momentum.

From Invisible to Indispensable — PCB Takes Center Stage in the AI Era

The grand TPCA Show 2025 opened at the Nangang Exhibition Center, with Zhen Ding Tech. Group (Stock Code: 4958) Chairman Charles Shen highlighting at the “Semiconductor X PCB Heterogeneous Integration Summit Forum” today (23rd) that from personal computers and mobile devices to cloud data centers, AI, and AIoT, the evolution of all electronic products is deeply tied to the development of PCBs and semiconductors. As AI and advanced packaging technologies continue to advance, PCBs are no longer silent supporters but are now being recognized as key forces driving industrial transformation.
Shen noted that the role of PCBs is shifting from “signal connection” to “system support.” In today’s era of high-performance computing, logic chips and high-bandwidth memory are increasingly integrated within the same platform. This means PCBs must accommodate larger sizes and more complex multilayer structures while maintaining signal integrity, thermal performance, and power distribution. For instance, the growing demand for AI servers and GPU accelerator cards has led to increases in PCB size and thickness, as well as more challenging structural and circuit precision requirements. Shen added that Taiwan currently leads the world with 69% global market share in semiconductors and 51% in packaging and testing, while its IC substrate share stands at 35%. With AI and heterogeneous integration accelerating, these figures are expected to rise further — reinforcing the PCB’s strategic importance as a core driver of industrial upgrading.

From Invisible to Indispensable — PCB Takes Center Stage in the AI Era

The grand TPCA Show 2025 opened at the Nangang Exhibition Center, with Zhen Ding Tech. Group (Stock Code: 4958) Chairman Charles Shen highlighting at the “Semiconductor X PCB Heterogeneous Integration Summit Forum” today (23rd) that from personal computers and mobile devices to cloud data centers, AI, and AIoT, the evolution of all electronic products is deeply tied to the development of PCBs and semiconductors. As AI and advanced packaging technologies continue to advance, PCBs are no longer silent supporters but are now being recognized as key forces driving industrial transformation.
Shen noted that the role of PCBs is shifting from “signal connection” to “system support.” In today’s era of high-performance computing, logic chips and high-bandwidth memory are increasingly integrated within the same platform. This means PCBs must accommodate larger sizes and more complex multilayer structures while maintaining signal integrity, thermal performance, and power distribution. For instance, the growing demand for AI servers and GPU accelerator cards has led to increases in PCB size and thickness, as well as more challenging structural and circuit precision requirements. Shen added that Taiwan currently leads the world with 69% global market share in semiconductors and 51% in packaging and testing, while its IC substrate share stands at 35%. With AI and heterogeneous integration accelerating, these figures are expected to rise further — reinforcing the PCB’s strategic importance as a core driver of industrial upgrading.

Zhen Ding’s subsidiary Avary Holding acquires Huayang to strengthen strategic deployment in AI intelligent driving and in-vehicle terminal systems

To strengthen its strategic deployment in AI intelligent driving and in-vehicle terminal systems, Zhen Ding Tech. Group (Stock Code: 4958) announced today (October 30th ) that its subsidiary, Avary Holding (Shenzhen) Co., Ltd., has declared the cash acquisition of Wuxi Huayang Science And Technology Co., Ltd.
Avary Holding plans to pay RMB 356.724164 million in cash to acquire 53.68% of Huayang’s equity. Upon completion, Huayang will become a consolidated subsidiary of Avary Holding.

Zhen Ding’s subsidiary Avary Holding acquires Huayang to strengthen strategic deployment in AI intelligent driving and in-vehicle terminal systems

To strengthen its strategic deployment in AI intelligent driving and in-vehicle terminal systems, Zhen Ding Tech. Group (Stock Code: 4958) announced today (October 30th ) that its subsidiary, Avary Holding (Shenzhen) Co., Ltd., has declared the cash acquisition of Wuxi Huayang Science And Technology Co., Ltd.
Avary Holding plans to pay RMB 356.724164 million in cash to acquire 53.68% of Huayang’s equity. Upon completion, Huayang will become a consolidated subsidiary of Avary Holding.

Zhen Ding Selected for the 2025 S&P Global Sustainability Yearbook as Taiwan’s Only PCB Company

Zhen Ding Again Reached Record Revenue and Net Profit for the Full Year of 2022

Zhen Ding Technology Holding Held 2023 AGM

Zhen Ding's Results in the Fourth Quarter of 2023 Reached the Peak of the Year, and the Company is Expected to Grow Moderately in 2024

Zhen Ding and Advantech Announce Stratetic Collatoration

Unlocking the Metaverse Factory: Reshaping the Future of Manufacturing

The 2024 Siemens Digital Industry Software Pan-Semiconductor and PCB Industry Digital Intelligence Innovation Summit was successfully held at the Avary Time Center

Global PCB Leader Zhen Ding Technology Partners with eslite spectrum to Create a New Urban Cultural Landscape in Qingpu Taoyuan

Scheduled to Open in 2028! New Corporate HQ to Showcase a 16,000sqm Store: Designed to Seamlessly Integrate Smart Green Energy with Cultural Creativity

EMC and Zhen Ding Reached Strategic Cooperation, Strengthen Both Development of Material Research and Smart Manufacturing

Zhen Ding Technology Holding Limited Thailand Plant Construction Milestone

Taiflex and Zhen Ding Form Strategic Partnership to Enhance Cooperation and Complement Each Other's Strengths

Zhen Ding Participates in SEMICON Taiwan for the First Time, Showcasing High-end IC Substrates and AI Server PCBs

Zhen Ding Achieved Top Ranking in 2024 S&P Global ESG Rating, Leading the PCB Industry

DuPont and Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End Printed Circuit Board Technology Development

TECO and Zhen Ding Reach Strategic Cooperation to Deepen Energy Saving, Carbon Reduction, and Sustainable Development Business

Zhen Ding Tech. Group Kaohsiung AI Park Obtained the Investment Approval by the Southern Taiwan Science Park Bureau

Zhen Ding’s Subsidiary BoardTek Electronics Experienced a Fire Incident

Zhen Ding Achieves CDP’s Highest “A” Rating for Water Security

CEO Conversation: DJ Lee, General Manager

CEO Conversations: Charles Shen, Chairman