Zhen Ding Tech. Group

ZDT Drives Smart Factory Maturity Assessments and Industrial Health Checks Benchmarking Semiconductor Standards for Manufacturing Excellence

In response to the trend of heterogeneous integration between semiconductors and PCBs and the rapid iteration of process technologies, Zhen Ding Tech. Group has fully launched its digital transformation strategy. Chairman Charles Shen emphasized, "The success of our digitalization and intelligence initiatives will determine the company's future." He noted that advancing smart manufacturing and digital transformation is crucial for enhancing competitive advantages and technology leadership. Consequently, Zhen Ding continues to invest in advanced process R&D and global capacity layout to build a highly intelligent production system that meets customer demands.

Led by President Chen-fu Chien, Zhen Ding’s digital transformation connects the semiconductor supply chain and optimizes core business processes. It accelerates organizational change through process streamlining, AI empowerment, and digital decision-making. Additionally, the newly established Smart Factory Planning Division has launched the Dr. Fab Industrial Health Check and the "Smart Factory Maturity Assessment." These initiatives establish a complete cycle—from unit self-assessment and preliminary evaluation to on-site reviews and continuous improvement strategies.

Zen Ding Holding and Topoint Technology Sign Strategic Cooperation Agreement Joining Forces to Advance High-End PCB Drilling Technologies

Shenzhen, China – December 1, 2025 – Zhen Ding Tech. Group (TWSE: 4958), the world’s largest
PCB manufacturer, and Topoint Technology Co., Ltd. (TWSE: 8021), a global leader in precision drill
bits and integrated drilling solutions, officially signed a strategic cooperation agreement today at
the Zen Ding Times Building in Shenzhen. The ceremony was jointly attended by Mr. Charles Shen,
Chairman of Zen Ding, and Mr. Lin Hsu-Ting, Chairman of Topoint Technology, along with senior
executives from both companies who witnessed this important milestone.

#SEMICONTaiwan 2025 is coming to an end!

Zhen Ding Technology Group exchanged insights on industry trends with supply chain partners and engaged with numerous potential customers, delivering on global needs through One ZDT. As the PCB and semiconductor ecosystems converge through heterogeneous integration, the industry landscape is being quietly reshaped, while AI computing power and innovative applications are unlocking new opportunities for growth. We sincerely thank all our distinguished guests and partners for joining us. Zhen Ding will continue to push beyond limits, strengthen its pivotal position, and drive a new chapter of co-creation between PCB and semiconductors. We look forward to seeing you next year!

Zhen Ding Builds a New Blueprint of “Semiconductor + Advanced Packaging + PCB” “One ZDT” Strategy Rides the Wave of Heterogeneous Integration to Seize the AI Industry High Ground

The annual PCB industry event, TPCA Show 2025, kicked off today (Oct. 22) at the Nangang Exhibition Center. Zhen Ding Tech. Group (Stock Code: 4958 showcased a full range of high-end PCBs and IC substrates under the theme of Artificial Intelligence (AI). Chairman Charles Shen pointed out that over the past 20 years, IC substrates have grown 20 times larger, increased in layer count by more than fourfold, and seen connection points surge by 300 times — resulting in overall complexity rising over 24,000 times. This evolution signifies that PCBs have transformed from mere connectors into core enablers of AI computing performance. Facing this AI- and high-performance computing-driven revolution, Zhen Ding has strengthened its “One ZDT” strategic layout, pioneering a new ecosystem of “Semiconductor + Advanced Packaging + PCB” to fuel future growth momentum.

Zhen Ding Builds a New Blueprint of “Semiconductor + Advanced Packaging + PCB” “One ZDT” Strategy Rides the Wave of Heterogeneous Integration to Seize the AI Industry High Ground

The annual PCB industry event, TPCA Show 2025, kicked off today (Oct. 22) at the Nangang Exhibition Center. Zhen Ding Tech. Group (Stock Code: 4958 showcased a full range of high-end PCBs and IC substrates under the theme of Artificial Intelligence (AI). Chairman Charles Shen pointed out that over the past 20 years, IC substrates have grown 20 times larger, increased in layer count by more than fourfold, and seen connection points surge by 300 times — resulting in overall complexity rising over 24,000 times. This evolution signifies that PCBs have transformed from mere connectors into core enablers of AI computing performance. Facing this AI- and high-performance computing-driven revolution, Zhen Ding has strengthened its “One ZDT” strategic layout, pioneering a new ecosystem of “Semiconductor + Advanced Packaging + PCB” to fuel future growth momentum.

From Invisible to Indispensable — PCB Takes Center Stage in the AI Era

The grand TPCA Show 2025 opened at the Nangang Exhibition Center, with Zhen Ding Tech. Group (Stock Code: 4958) Chairman Charles Shen highlighting at the “Semiconductor X PCB Heterogeneous Integration Summit Forum” today (23rd) that from personal computers and mobile devices to cloud data centers, AI, and AIoT, the evolution of all electronic products is deeply tied to the development of PCBs and semiconductors. As AI and advanced packaging technologies continue to advance, PCBs are no longer silent supporters but are now being recognized as key forces driving industrial transformation.
Shen noted that the role of PCBs is shifting from “signal connection” to “system support.” In today’s era of high-performance computing, logic chips and high-bandwidth memory are increasingly integrated within the same platform. This means PCBs must accommodate larger sizes and more complex multilayer structures while maintaining signal integrity, thermal performance, and power distribution. For instance, the growing demand for AI servers and GPU accelerator cards has led to increases in PCB size and thickness, as well as more challenging structural and circuit precision requirements. Shen added that Taiwan currently leads the world with 69% global market share in semiconductors and 51% in packaging and testing, while its IC substrate share stands at 35%. With AI and heterogeneous integration accelerating, these figures are expected to rise further — reinforcing the PCB’s strategic importance as a core driver of industrial upgrading.

From Invisible to Indispensable — PCB Takes Center Stage in the AI Era

The grand TPCA Show 2025 opened at the Nangang Exhibition Center, with Zhen Ding Tech. Group (Stock Code: 4958) Chairman Charles Shen highlighting at the “Semiconductor X PCB Heterogeneous Integration Summit Forum” today (23rd) that from personal computers and mobile devices to cloud data centers, AI, and AIoT, the evolution of all electronic products is deeply tied to the development of PCBs and semiconductors. As AI and advanced packaging technologies continue to advance, PCBs are no longer silent supporters but are now being recognized as key forces driving industrial transformation.
Shen noted that the role of PCBs is shifting from “signal connection” to “system support.” In today’s era of high-performance computing, logic chips and high-bandwidth memory are increasingly integrated within the same platform. This means PCBs must accommodate larger sizes and more complex multilayer structures while maintaining signal integrity, thermal performance, and power distribution. For instance, the growing demand for AI servers and GPU accelerator cards has led to increases in PCB size and thickness, as well as more challenging structural and circuit precision requirements. Shen added that Taiwan currently leads the world with 69% global market share in semiconductors and 51% in packaging and testing, while its IC substrate share stands at 35%. With AI and heterogeneous integration accelerating, these figures are expected to rise further — reinforcing the PCB’s strategic importance as a core driver of industrial upgrading.

Zhen Ding’s subsidiary Avary Holding acquires Huayang to strengthen strategic deployment in AI intelligent driving and in-vehicle terminal systems

To strengthen its strategic deployment in AI intelligent driving and in-vehicle terminal systems, Zhen Ding Tech. Group (Stock Code: 4958) announced today (October 30th ) that its subsidiary, Avary Holding (Shenzhen) Co., Ltd., has declared the cash acquisition of Wuxi Huayang Science And Technology Co., Ltd.
Avary Holding plans to pay RMB 356.724164 million in cash to acquire 53.68% of Huayang’s equity. Upon completion, Huayang will become a consolidated subsidiary of Avary Holding.

Zhen Ding’s subsidiary Avary Holding acquires Huayang to strengthen strategic deployment in AI intelligent driving and in-vehicle terminal systems

To strengthen its strategic deployment in AI intelligent driving and in-vehicle terminal systems, Zhen Ding Tech. Group (Stock Code: 4958) announced today (October 30th ) that its subsidiary, Avary Holding (Shenzhen) Co., Ltd., has declared the cash acquisition of Wuxi Huayang Science And Technology Co., Ltd.
Avary Holding plans to pay RMB 356.724164 million in cash to acquire 53.68% of Huayang’s equity. Upon completion, Huayang will become a consolidated subsidiary of Avary Holding.

Zhen Ding Reports Solid Performance for the First Three Quarters of 2025

Zhen Ding Reports Solid Performance for the First Three Quarters of 2025

ZDT & AIT Host Inaugural Semiconductor Forum Uniting Global Strengths to Drive PCB-Semiconductor Integration

Global PCB leader Zhen Ding Tech Group (ZDT) partnered with the Asian Institute of Technology (AIT) on November 13 to host the inaugural "AIT-ZDT Forum" in Bangkok, Thailand. Themed "Regional Development in the Semiconductor Age," the event gathered over 100 distinguished leaders from industry, government, and academia to jointly chart a blueprint for technological
innovation, high-end talent development, and regional supply chain resilience. Through this cross-border exchange, ZDT continues to deepen its semiconductor deployment. By fully leveraging the unique strategic value of its "One ZDT" strategy in high-end processes and cross-platform integration, the Group aims to drive Asia to establish a leading position in the field of heterogeneous integration within the semiconductor ecosystem.

ZDT & AIT Host Inaugural Semiconductor Forum Uniting Global Strengths to Drive PCB-Semiconductor Integration

Global PCB leader Zhen Ding Tech Group (ZDT) partnered with the Asian Institute of Technology (AIT) on November 13 to host the inaugural "AIT-ZDT Forum" in Bangkok, Thailand. Themed "Regional Development in the Semiconductor Age," the event gathered over 100 distinguished leaders from industry, government, and academia to jointly chart a blueprint for technological
innovation, high-end talent development, and regional supply chain resilience. Through this cross-border exchange, ZDT continues to deepen its semiconductor deployment. By fully leveraging the unique strategic value of its "One ZDT" strategy in high-end processes and cross-platform integration, the Group aims to drive Asia to establish a leading position in the field of heterogeneous integration within the semiconductor ecosystem.

Zhen Ding Named among Business Weekly’s 2025 Top 100 Carbon Competitiveness

Zhen Ding Technology Holding Limited (Stock Code: 4958) announced a new milestone in its sustainability journey, being selected by Business Weekly as one of the “2025 Top 100 Carbon Competitiveness Companies.” With outstanding achievements in both carbon reduction and business performance, Zhen Ding recorded a 23% annual carbon-emission reduction rate and a 27% increase in carbon productivity (revenue generated per metric ton of CO₂ emissions) in 2024, ranking fifth among all companies listed in the Top 100. This recognition underscores Zhen Ding’s firm commitment to green manufacturing and its competitive strength as a global leader in the PCB industry.

Zhen Ding Named among Business Weekly’s 2025 Top 100 Carbon Competitiveness

Zhen Ding Technology Holding Limited (Stock Code: 4958) announced a new milestone in its sustainability journey, being selected by Business Weekly as one of the “2025 Top 100 Carbon Competitiveness Companies.” With outstanding achievements in both carbon reduction and business performance, Zhen Ding recorded a 23% annual carbon-emission reduction rate and a 27% increase in carbon productivity (revenue generated per metric ton of CO₂ emissions) in 2024, ranking fifth among all companies listed in the Top 100. This recognition underscores Zhen Ding’s firm commitment to green manufacturing and its competitive strength as a global leader in the PCB industry.

Zen Ding Holding and Topoint Technology Sign Strategic Cooperation Agreement Joining Forces to Advance High-End PCB Drilling Technologies

Shenzhen, China – December 1, 2025 – Zhen Ding Tech. Group (TWSE: 4958), the world’s largest
PCB manufacturer, and Topoint Technology Co., Ltd. (TWSE: 8021), a global leader in precision drill
bits and integrated drilling solutions, officially signed a strategic cooperation agreement today at
the Zen Ding Times Building in Shenzhen. The ceremony was jointly attended by Mr. Charles Shen,
Chairman of Zen Ding, and Mr. Lin Hsu-Ting, Chairman of Topoint Technology, along with senior
executives from both companies who witnessed this important milestone.

ZDT President Chen-Fu Chien Honored with the “K. T. Li Management Medal” Integrating Theory and Practice to Advance Taiwan’s Industrial Smart Transformation

Chen-Fu Chien, President of Zhen Ding Tech. Group (Ticker: 4958), has been awarded the prestigious “K. T. Li Management Medal.” This honor recognizes his long-term dedication and outstanding achievements in decision analytics, smart manufacturing, digital transformation, and industry–academia collaboration. The award affirms his exceptional ability to bridge academic insight with industrial leadership, contributing concretely to Taiwan’s industrial upgrading.
Established by the Operations Research Society of Taiwan in memory of Mr. K. T. Li’s significant contributions to Taiwan’s economic development, the “K. T. Li Management Medal” is one of the most important honors in the field of management in Taiwan. Award recipient James Chien leads the National Science and Technology Council’s Artificial Intelligence for Manufacturing Systems (AIMS) Research Center, driving smart manufacturing and AI-powered transformation. Deeply committed to academic research and talent development, he has addressed Taiwan’s industrial challenges by proposing theories such as “UNISON Decision,” “Industry 3.5,” and the “Blue Ocean–Blue Lake Strategy.” He has published more than 230 international journal papers, holds 24 invention patents, and has been cited over 13,000 times. He has also been listed among the Top 2% Scientists Worldwide for several consecutive years. His works include Harvard Business School cases on companies such as TSMC and MediaTek, as well as books such as Industry 3.5 and Blue Lake Strategy, which have won the Ministry of Economic Affairs’ Golden Book Award and the NSTC Most Influential Research Monograph Award.

IC Heterogeneous Integration and Advanced Packaging Zhen Ding Drives AI-Powered Digital Transformation

Driven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
At SEMICON Taiwan 2025’s High-Tech Smart Manufacturing Forum, President of Zhen Ding Technology Holding Limited (Stock Code: 4958), Chen-Fu Chien, delivered the opening keynote. He reviewed how wafer manufacturing has long advanced under Moore’s Law, with continuous process scaling enabling flourishing development across various application fields. However, as scaling approaches physical limits and economic considerations of cost-effectiveness intensify, heterogeneous integration and advanced packaging technologies have emerged as new growth drivers to realize the vision of “More than Moore.”

ZDT President Chen-Fu Chien Honored with the “K. T. Li Management Medal” Integrating Theory and Practice to Advance Taiwan’s Industrial Smart Transformation

Chen-Fu Chien, President of Zhen Ding Tech. Group (Ticker: 4958), has been awarded the prestigious “K. T. Li Management Medal.” This honor recognizes his long-term dedication and outstanding achievements in decision analytics, smart manufacturing, digital transformation, and industry–academia collaboration. The award affirms his exceptional ability to bridge academic insight with industrial leadership, contributing concretely to Taiwan’s industrial upgrading.
Established by the Operations Research Society of Taiwan in memory of Mr. K. T. Li’s significant contributions to Taiwan’s economic development, the “K. T. Li Management Medal” is one of the most important honors in the field of management in Taiwan. Award recipient James Chien leads the National Science and Technology Council’s Artificial Intelligence for Manufacturing Systems (AIMS) Research Center, driving smart manufacturing and AI-powered transformation. Deeply committed to academic research and talent development, he has addressed Taiwan’s industrial challenges by proposing theories such as “UNISON Decision,” “Industry 3.5,” and the “Blue Ocean–Blue Lake Strategy.” He has published more than 230 international journal papers, holds 24 invention patents, and has been cited over 13,000 times. He has also been listed among the Top 2% Scientists Worldwide for several consecutive years. His works include Harvard Business School cases on companies such as TSMC and MediaTek, as well as books such as Industry 3.5 and Blue Lake Strategy, which have won the Ministry of Economic Affairs’ Golden Book Award and the NSTC Most Influential Research Monograph Award.

Zhen Ding IE Academy Launches Digital Transformation Talent Development Program Integrating Training and Practice with the 4A Framework to Accelerate Group-wide Digital Transformation

Facing rapid technological evolution and intense industry competition, Zhen Ding Tech. Group Chairman Charles Shen has announced a strategic blueprint emphasizing that “the success of digital intelligence (DX + AI) will determine the company’s future.” He has tasked Group CEO James Chien with leading the organization to complete the digital transformation and AI empowerment of eleven key processes within three years, while driving organizational development and change. To support this mission, the Zhen Ding IE Academy has officially launched its digital transformation talent development strategy. By introducing the 4A Framework and implementing cross-department transformation projects, the Academy combines training and real-world practice, enabling internal talents to grow rapidly and deliver results at scale.

Zhen Ding IE Academy Launches Digital Transformation Talent Development Program Integrating Training and Practice with the 4A Framework to Accelerate Group-wide Digital Transformation

Facing rapid technological evolution and intense industry competition, Zhen Ding Tech. Group Chairman Charles Shen has announced a strategic blueprint emphasizing that “the success of digital intelligence (DX + AI) will determine the company’s future.” He has tasked Group CEO James Chien with leading the organization to complete the digital transformation and AI empowerment of eleven key processes within three years, while driving organizational development and change. To support this mission, the Zhen Ding IE Academy has officially launched its digital transformation talent development strategy. By introducing the 4A Framework and implementing cross-department transformation projects, the Academy combines training and real-world practice, enabling internal talents to grow rapidly and deliver results at scale.

Jinzhou Technology and Zhen Ding Technology Signed Strategic Cooperation Agreement

Shenzhen, China – December 1, 2025 – Zhen Ding Tech. Group (TWSE: 4958), the world’s largest
PCB manufacturer, and Topoint Technology Co., Ltd. (TWSE: 8021), a global leader in precision drill
bits and integrated drilling solutions, officially signed a strategic cooperation agreement today at
the Zen Ding Times Building in Shenzhen. The ceremony was jointly attended by Mr. Charles Shen,
Chairman of Zen Ding, and Mr. Lin Hsu-Ting, Chairman of Topoint Technology, along with senior
executives from both companies who witnessed this important milestone.

Jinzhou Technology and Zhen Ding Technology Signed Strategic Cooperation Agreement

On January 27, 2026, Zhen Ding Technology Group (4958-TW) and Jinzhou Technology signed a landmark strategic cooperation agreement in AVARY Time Center, Shenzhen. Mr. Charles Shen, Chairman of Zhen Ding Technology Group, and Mr. Luo Chunfeng, General Manager of Jinzhou Technology, attended the signing ceremony. Both parties agreed to establish comprehensive strategic partnership to jointly promote OEM/ODM customer development, leading-edge technology R&D, material performance improvement and environmental protection practice, and further deepen cooperation in intelligent manufacturing, corporate governance, ESG and other aspects.

Zhen Ding Builds Postdoctoral Innovation Base and Digital Transformation Accelerator to Advance Industry–Academia Partnerships

Zhen Ding Technology Group is accelerating digital transformation and organizational development by establishing a Postdoctoral Innovation Practice Base—a key milestone in its digital transformation innovation accelerator. The Base will strengthen industry–academia R&D collaboration and strategic talent development, serving as an engine for technology breakthroughs, manufacturing excellence, and talent cultivation. Through long-term, win–win partnerships with more than 25 universities worldwide, the Group will actively attract and develop top talent.

At the Jan. 30 unveiling of the Postdoctoral Innovation Practice Base at Zhen Ding’s Shenzhen campus, Chairman Charles Shen said talent is the company’s most valuable asset—and early, deliberate talent deployment has been key to the Group’s continued growth. He said the Base is a concrete step to attract and develop top talent, and appointed President and General Manager Chen-Fu Chien to lead the Organizational Development Committee to advance leadership development and recruit strategic technology talent—delivering value across “One ZDT” scenarios and accelerating AI value-chain development and heterogeneous integration.

Zhen Ding Builds Postdoctoral Innovation Base and Digital Transformation Accelerator to Advance Industry–Academia Partnerships

Zhen Ding Technology Group is accelerating digital transformation and organizational development by establishing a Postdoctoral Innovation Practice Base—a key milestone in its digital transformation innovation accelerator. The Base will strengthen industry–academia R&D collaboration and strategic talent development, serving as an engine for technology breakthroughs, manufacturing excellence, and talent cultivation. Through long-term, win–win partnerships with more than 25 universities worldwide, the Group will actively attract and develop top talent.

At the Jan. 30 unveiling of the Postdoctoral Innovation Practice Base at Zhen Ding’s Shenzhen campus, Chairman Charles Shen said talent is the company’s most valuable asset—and early, deliberate talent deployment has been key to the Group’s continued growth. He said the Base is a concrete step to attract and develop top talent, and appointed President and General Manager Chen-Fu Chien to lead the Organizational Development Committee to advance leadership development and recruit strategic technology talent—delivering value across “One ZDT” scenarios and accelerating AI value-chain development and heterogeneous integration.

Zhen Ding Subsidiary Leading Awarded the 23rd "Shenzhen Top Brands" Title

Zhen Ding Technology Holding Limited (Ticker: 4958), a global leading PCB manufacturer, today announced its subsidiary, Leading Interconnect Semiconductor Technology Co.,Ltd has been awarded the prestigious title of "23rd Shenzhen (Bay Area) Top Brands", recognizing its technological strength and forward-looking strategy in the high-end IC substrate sector.

This award not only recognizes Leading's contributions to advanced semiconductor packaging but also marks a significant milestone for Zhen Ding as it solidifies its presence in a critical segment of the semiconductor industry.

Zhen Ding Subsidiary Leading Awarded the 23rd "Shenzhen Top Brands" Title

Zhen Ding Technology Holding Limited (Ticker: 4958), a global leading PCB manufacturer, today announced its subsidiary, Leading Interconnect Semiconductor Technology Co.,Ltd has been awarded the prestigious title of "23rd Shenzhen (Bay Area) Top Brands", recognizing its technological strength and forward-looking strategy in the high-end IC substrate sector.

This award not only recognizes Leading's contributions to advanced semiconductor packaging but also marks a significant milestone for Zhen Ding as it solidifies its presence in a critical segment of the semiconductor industry.

Zhen Ding Reported Its Operating Results for the Full Year of 2025

Zhen Ding Technology Holding Limited (Ticker: 4958), a global leading PCB manufacturer, today heldan investor conference and announced its consolidated financial results for the full year of 2025. Revenue for full-year 2025 reached NT$182.52 billion, marking a record high and reaffirming its position as the world’s largest PCB manufacturer for the ninth consecutive year. Net income for theyear was NT$10.61 billion, with net income attributable to the parent company of NT$6.79 billionand EPS of NT$6.91.

According to Chairman Charles Shen, Zhen Ding maintained steady growth in 2025, with full-year revenue rising 6.3% YoY to a record high. Among the four major application segments, revenue from Mobile Communications, Server/Optical, and IC Substrates all reached new highs, with AI-related applications accounting for nearly 70% of total revenue. Gross margin for 2025 was 19.8% and operating margin was 7.6%, both improving by 0.9 percentage points compared with the previous year. The improvement was mainly driven by a higher contribution from high-end AI applications and continued optimization of the product mix, further strengthening the company’s overall profitability structure.

Zhen Ding Reported Its Operating Results for the Full Year of 2025

Zhen Ding Technology Holding Limited (Ticker: 4958), a global leading PCB manufacturer, today heldan investor conference and announced its consolidated financial results for the full year of 2025. Revenue for full-year 2025 reached NT$182.52 billion, marking a record high and reaffirming its position as the world’s largest PCB manufacturer for the ninth consecutive year. Net income for theyear was NT$10.61 billion, with net income attributable to the parent company of NT$6.79 billionand EPS of NT$6.91.

According to Chairman Charles Shen, Zhen Ding maintained steady growth in 2025, with full-year revenue rising 6.3% YoY to a record high. Among the four major application segments, revenue from Mobile Communications, Server/Optical, and IC Substrates all reached new highs, with AI-related applications accounting for nearly 70% of total revenue. Gross margin for 2025 was 19.8% and operating margin was 7.6%, both improving by 0.9 percentage points compared with the previous year. The improvement was mainly driven by a higher contribution from high-end AI applications and continued optimization of the product mix, further strengthening the company’s overall profitability structure.

Zhen Ding Reports Solid Performance for the First Quarters of 2026

Zhen Ding Technology Holding Limited (Ticker: 4958), a global leading PCB manufacturer, today (12)
announced its consolidated financial results for the first quarter of 2026. First quarter revenue reached NT$40,728 million, up 1.6% YoY and setting a record high for the same period. Net income
was NT$2,047 million, and net income attributable to the parent company was NT$1,426 million,
with EPS of NT$1.33.

Zhen Ding Reports Solid Performance for the First Quarters of 2026

Zhen Ding Technology Holding Limited (Ticker: 4958), a global leading PCB manufacturer, today (12)
announced its consolidated financial results for the first quarter of 2026. First quarter revenue reached NT$40,728 million, up 1.6% YoY and setting a record high for the same period. Net income
was NT$2,047 million, and net income attributable to the parent company was NT$1,426 million,
with EPS of NT$1.33.

IC Heterogeneous Integration and Advanced Packaging Zhen Ding Drives AI-Powered Digital Transformation

Driven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
At SEMICON Taiwan 2025’s High-Tech Smart Manufacturing Forum, President of Zhen Ding Technology Holding Limited (Stock Code: 4958), Chen-Fu Chien, delivered the opening keynote. He reviewed how wafer manufacturing has long advanced under Moore’s Law, with continuous process scaling enabling flourishing development across various application fields. However, as scaling approaches physical limits and economic considerations of cost-effectiveness intensify, heterogeneous integration and advanced packaging technologies have emerged as new growth drivers to realize the vision of “More than Moore.”

Zhen Ding Again Reached Record Revenue and Net Profit for the Full Year of 2022

Zhen Ding Technology Holding Held 2023 AGM

Zhen Ding's Results in the Fourth Quarter of 2023 Reached the Peak of the Year, and the Company is Expected to Grow Moderately in 2024

Zhen Ding and Advantech Announce Stratetic Collatoration

Unlocking the Metaverse Factory: Reshaping the Future of Manufacturing

The 2024 Siemens Digital Industry Software Pan-Semiconductor and PCB Industry Digital Intelligence Innovation Summit was successfully held at the Avary Time Center

Global PCB Leader Zhen Ding Technology Partners with eslite spectrum to Create a New Urban Cultural Landscape in Qingpu Taoyuan

Scheduled to Open in 2028! New Corporate HQ to Showcase a 16,000sqm Store: Designed to Seamlessly Integrate Smart Green Energy with Cultural Creativity

EMC and Zhen Ding Reached Strategic Cooperation, Strengthen Both Development of Material Research and Smart Manufacturing

Zhen Ding Technology Holding Limited Thailand Plant Construction Milestone

Taiflex and Zhen Ding Form Strategic Partnership to Enhance Cooperation and Complement Each Other's Strengths

Zhen Ding Participates in SEMICON Taiwan for the First Time, Showcasing High-end IC Substrates and AI Server PCBs

Zhen Ding Achieved Top Ranking in 2024 S&P Global ESG Rating, Leading the PCB Industry

DuPont and Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End Printed Circuit Board Technology Development

TECO and Zhen Ding Reach Strategic Cooperation to Deepen Energy Saving, Carbon Reduction, and Sustainable Development Business

Zhen Ding Tech. Group Kaohsiung AI Park Obtained the Investment Approval by the Southern Taiwan Science Park Bureau

Zhen Ding’s Subsidiary BoardTek Electronics Experienced a Fire Incident

Zhen Ding Achieves CDP’s Highest “A” Rating for Water Security

Zhen Ding Selected for the 2025 S&P Global Sustainability Yearbook as Taiwan’s Only PCB Company

Zhen Ding Held the Groundbreaking Ceremony for “Zhen Ding Time Center”, Creating a Joint Hub for PCB and Cultural Industries

Zhen Ding Announces the Appointment of Dr. Chen-Fu Chien as General Manager to Accelerate Digital Transformation and Strengthen Business Developments with the Semiconductor Supply Chain

Zhen Ding Announced Its Operating Results for the First Half of 2025

Zhen Ding Announced Its Operating Results for the First Half of 2025

Avary Holding, a Subsidiary of Zhen Ding, Board Approves Huai’an Park Investment Plan

Avary Holding, a Subsidiary of Zhen Ding, Board Approves Huai’an Park Investment Plan

Zhen Ding Returns to SEMICON Taiwan 2025, Unveiling a New Landscape of PCB Expanding into Semiconductors Advantech Empowers the Creation of AI Smart Parks, Jointly Building a New Model for Smart and Green Manufacturing

Zhen Ding Technology Holding Co., Ltd. (Stock Code: 4958), a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025 today (the 10th). Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout. Zhen Ding stated that this exhibition is not only a concrete demonstration of its R&D achievements but also a declaration of its industry status, symbolizing the company’s evolution from a PCB leader to a key driver in the semiconductor industry chain, injecting continuous momentum into the development of AI applications.
With the increasing complexity of chips and the popularization of 3D packaging, PCB is no longer merely a circuit carrier, but a critical link determining whether computing power can be fully unleashed. In particular, many AI applications impose stringent requirements on PCBs, such as high frequency, high speed, high density, high reliability, and low energy consumption. A single manufacturing process can hardly meet these demands; thus, integrating different processes—including high-end IC substrates, high-end HDI/MSAP substrates, and HLC thick large boards—has become the key to achieving performance breakthroughs. Centering on the "One ZDT" strategy, Zhen Ding will fully deploy "cloud, pipe, and device" applications in the AI era, provide customers with the most comprehensive solutions, and leverage its advantage in the vertical integration layout of the full AI PCB product line to continuously widen the leading gap with competitors in the AI era.
Beyond forward-looking technological layout, Zhen Ding is also actively advancing AI smart manufacturing and green digital transformation. Through cooperation with Advantech (Stock Code: 2395), a leader in the industrial IoT industry, Zhen Ding has achieved multi-faceted results in digital transformation. It has now adopted Advantech’s energy management platform, and Advantech has also shared solutions and implementation experience related to smart parks and carbon management platforms. These achievements not only enhance energy conservation and carbon reduction efforts but also reflect Zhen Ding’s commitment to sustainable ESG practices.

Zhen Ding Returns to SEMICON Taiwan 2025, Unveiling a New Landscape of PCB Expanding into Semiconductors Advantech Empowers the Creation of AI Smart Parks, Jointly Building a New Model for Smart and Green Manufacturing

Zhen Ding Technology Holding Co., Ltd. (Stock Code: 4958), a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025 today (the 10th). Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout. Zhen Ding stated that this exhibition is not only a concrete demonstration of its R&D achievements but also a declaration of its industry status, symbolizing the company’s evolution from a PCB leader to a key driver in the semiconductor industry chain, injecting continuous momentum into the development of AI applications.
With the increasing complexity of chips and the popularization of 3D packaging, PCB is no longer merely a circuit carrier, but a critical link determining whether computing power can be fully unleashed. In particular, many AI applications impose stringent requirements on PCBs, such as high frequency, high speed, high density, high reliability, and low energy consumption. A single manufacturing process can hardly meet these demands; thus, integrating different processes—including high-end IC substrates, high-end HDI/MSAP substrates, and HLC thick large boards—has become the key to achieving performance breakthroughs. Centering on the "One ZDT" strategy, Zhen Ding will fully deploy "cloud, pipe, and device" applications in the AI era, provide customers with the most comprehensive solutions, and leverage its advantage in the vertical integration layout of the full AI PCB product line to continuously widen the leading gap with competitors in the AI era.
Beyond forward-looking technological layout, Zhen Ding is also actively advancing AI smart manufacturing and green digital transformation. Through cooperation with Advantech (Stock Code: 2395), a leader in the industrial IoT industry, Zhen Ding has achieved multi-faceted results in digital transformation. It has now adopted Advantech’s energy management platform, and Advantech has also shared solutions and implementation experience related to smart parks and carbon management platforms. These achievements not only enhance energy conservation and carbon reduction efforts but also reflect Zhen Ding’s commitment to sustainable ESG practices.

The Era of Computing Power: AI Reshapes the PCB Industry Landscape

Artificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation. At the SEMICON Taiwan 2025 Innovation Technology Conference on Sep 11th, Allen Chien, Senior Manager of Zhen Ding Technology Holding Co., Ltd. (Stock Code: 4958), highlighted that global computing power is expected to surge nearly a hundredfold by 2030 compared to 2021. This growth is driving cloud service providers to invest heavily in AI servers and data centers. This infrastructure race is not only accelerating the advancement of the semiconductor industry but also underscoring the indispensable role of PCBs in the era of computing power.
As Moore’s Law approaches its limits, breakthroughs in computational performance increasingly rely on advanced packaging and heterogeneous integration. Most mainstream high-performance computing chips now adopt multi-chip module designs, integrating logic computing units, high-bandwidth memory, and other components closely on the same substrate. This approach shortens signal transmission distances, reduces power consumption, and enhances computing efficiency. Such technological evolution has transformed PCBs from merely serving as signal transmission and structural support components into the core backbone determining system performance.

The Era of Computing Power: AI Reshapes the PCB Industry Landscape

Artificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation. At the SEMICON Taiwan 2025 Innovation Technology Conference on Sep 11th, Allen Chien, Senior Manager of Zhen Ding Technology Holding Co., Ltd. (Stock Code: 4958), highlighted that global computing power is expected to surge nearly a hundredfold by 2030 compared to 2021. This growth is driving cloud service providers to invest heavily in AI servers and data centers. This infrastructure race is not only accelerating the advancement of the semiconductor industry but also underscoring the indispensable role of PCBs in the era of computing power.
As Moore’s Law approaches its limits, breakthroughs in computational performance increasingly rely on advanced packaging and heterogeneous integration. Most mainstream high-performance computing chips now adopt multi-chip module designs, integrating logic computing units, high-bandwidth memory, and other components closely on the same substrate. This approach shortens signal transmission distances, reduces power consumption, and enhances computing efficiency. Such technological evolution has transformed PCBs from merely serving as signal transmission and structural support components into the core backbone determining system performance.

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