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Zhen Ding Tech. Group

Products & Services

Zhen Ding Group is committed to efficiency and the constant pursuit of innovation. With trends toward lightweightness, automation, connectivity, and motorization, we adopt advanced technologies to provide products that meet the requirements of cutting-edge applications.

"Exceeding customer expectations" has always been one of the strategic objectives of the development of Zhen Ding Tecn. Group. Based on our high-quality customized manufacturing services, continues to improve equipment and process capabilities, and actively participate in advanced product R&D and design for customer, to provide customers with trusted products and services.

Our main customers are international renowned brands of electronic system or global electronic foundry enterprises. To meet customer needs, the company provides a short period of time to quickly design, develop samples to quickly ramp-up and mass production services, to help customers shorten the time to market and win the market opportunity in advance, that is, to help customers establish a successful operating model to Time to Market , Time to Volume , Time to Money / Market share.

In order to ensure that all products can meet customer needs after products sales in the market, in the early stage of product design, the company develops the product with customers in advance, and constantly strengthen our own technology, keep excellence, grasp market trends and new product opportunities based on our R&D advantages.

The company provides customers with flexible and high-quality customized manufacturing services and the advantages of multi-factory production bases close to customers, and has created a comprehensive PCB covering multiple types of products such as FPC, HDI, RCB, Module, SLP, Rigid Flex, Mini LED etc., the one-stop product service platform, to meet the customer's goal of purchasing enough at once and establishes a long-term partnership with customers.


FPC: Flexible Printed Circuit. A special kind of PCB which has the advantage of light, thin, soft and flexable. FPC is mainly used in smartphones, notebooks, smart wearable devices and many other products.

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SLP: Substrate-Like PCB. SLP is called the "next generation of PCB". The L/S of SLP can be as low as 20/35um, compared to 40/50um of HDI. SLP is closer to IC substrate used for semiconductor packaging in manufacturing process.

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HDI: High Density Interconnect PCB. HDI has small size, high circuit distribution density, and good transmission efficiency, conducive to the use of advanced packaging technology, the cost is lower than traditional PCB when the layers exceeds 8L.

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RPCB: Rigid PCB. RPCB is made of non-flexible base material, it can provide support for the electronic components on it. After being made, it is fixed in the casing of device. It is a circuit board that almost all electronic products must use.

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IC substrate is an intermedium that communicates chip and circuit board. Chip and circuit board can be connected by its internal circuit. It is a key component of the IC packaging process which characterized by light weight, small size, stable quality and excellent information access.

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Rigid Flex has the advantages of rigid PCB and Flex PCB, it has smaller space occupation, better signal transmission reliability. Rigid Flex adapts to the current trend of end products that are becoming thinner and lighter.

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Mini LED

Mini LED PCB. The light source has been shortened by shortening the pad gap to 15~32 microns, and BT packaging substrate materials have been applied.
It can achieve a more finely pixelated dynamic backlight effect, effectively improve the screen brightness and contrast, and adapt to the current product requirements and trends

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Using SMT (surface mount technology) and other technologies, we provide professional surface mount services, as well as various precision parts assembly and testing. We provide value-added Total Solution services to customers.

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