From Invisible to Indispensable — PCB Takes Center Stage in the AI Era
The grand TPCA Show 2025 opened at the Nangang Exhibition Center, with Zhen Ding Tech. Group (Stock Code: 4958) Chairman Charles Shen highlighting at the “Semiconductor X PCB Heterogeneous Integration Summit Forum” today (23rd) that from personal computers and mobile devices to cloud data centers, AI, and AIoT, the evolution of all electronic products is deeply tied to the development of PCBs and semiconductors. As AI and advanced packaging technologies continue to advance, PCBs are no longer silent supporters but are now being recognized as key forces driving industrial transformation.
Shen noted that the role of PCBs is shifting from “signal connection” to “system support.” In today’s era of high-performance computing, logic chips and high-bandwidth memory are increasingly integrated within the same platform. This means PCBs must accommodate larger sizes and more complex multilayer structures while maintaining signal integrity, thermal performance, and power distribution. For instance, the growing demand for AI servers and GPU accelerator cards has led to increases in PCB size and thickness, as well as more challenging structural and circuit precision requirements. Shen added that Taiwan currently leads the world with 69% global market share in semiconductors and 51% in packaging and testing, while its IC substrate share stands at 35%. With AI and heterogeneous integration accelerating, these figures are expected to rise further — reinforcing the PCB’s strategic importance as a core driver of industrial upgrading.
