The Era of Computing Power: AI Reshapes the PCB Industry Landscape
Artificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation. At the SEMICON Taiwan 2025 Innovation Technology Conference on Sep 11th, Allen Chien, Senior Manager of Zhen Ding Technology Holding Co., Ltd. (Stock Code: 4958), highlighted that global computing power is expected to surge nearly a hundredfold by 2030 compared to 2021. This growth is driving cloud service providers to invest heavily in AI servers and data centers. This infrastructure race is not only accelerating the advancement of the semiconductor industry but also underscoring the indispensable role of PCBs in the era of computing power.
As Moore’s Law approaches its limits, breakthroughs in computational performance increasingly rely on advanced packaging and heterogeneous integration. Most mainstream high-performance computing chips now adopt multi-chip module designs, integrating logic computing units, high-bandwidth memory, and other components closely on the same substrate. This approach shortens signal transmission distances, reduces power consumption, and enhances computing efficiency. Such technological evolution has transformed PCBs from merely serving as signal transmission and structural support components into the core backbone determining system performance.
