IC Heterogeneous Integration and Advanced Packaging Zhen Ding Drives AI-Powered Digital Transformation
Driven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
At SEMICON Taiwan 2025’s High-Tech Smart Manufacturing Forum, President of Zhen Ding Technology Holding Limited (Stock Code: 4958), Chen-Fu Chien, delivered the opening keynote. He reviewed how wafer manufacturing has long advanced under Moore’s Law, with continuous process scaling enabling flourishing development across various application fields. However, as scaling approaches physical limits and economic considerations of cost-effectiveness intensify, heterogeneous integration and advanced packaging technologies have emerged as new growth drivers to realize the vision of “More than Moore.”
